12th Passed (10+2) with Physics, Chemistry, and Mathematics from a recognized board. (As per university norms / entrance criteria)
Program Overview
The B.Tech in Electronics & Communication Engineering with specialization in VLSI & Packaging is a future-focused undergraduate program designed to prepare students for careers in semiconductor design, chip manufacturing, and electronic system development.
The program provides a strong foundation in core electronics, communication systems, and embedded technologies, along with specialized training in Very Large Scale Integration (VLSI), chip design, semiconductor fabrication, and electronic packaging.
Students gain hands-on experience in circuit design, FPGA programming, ASIC design, and IC layout techniques. The curriculum also covers advanced topics such as microelectronics, system-on-chip (SoC) design, and semiconductor packaging technologies, which are critical in modern electronics industries.
With the growing demand for semiconductor professionals globally, this program equips students with the skills required to work in high-tech industries including chip design companies, electronics manufacturing, and R&D organizations.
Programme Educational Objectives (PEOs)
PEO-1
Develop strong foundational knowledge in electronics, communication, and semiconductor technologies.
PEO-2
Equip students with practical skills in VLSI design, chip fabrication, and electronic packaging.
PEO-3
Enable students to design, analyze, and develop electronic systems and integrated circuits.
PEO-4
Promote innovation, research, and problem-solving in advanced electronics domains.
PEO-5
Prepare graduates for successful careers or higher education in semiconductor and electronics industries.
Programme Outcomes (POs)
POs-1
Engineering Knowledge: Apply knowledge of mathematics, electronics, and communication engineering fundamentals.
POs-2
Problem Analysis: Analyze complex engineering problems in electronics and semiconductor systems.
POs-3
Design & Development: Design electronic circuits, systems, and VLSI architectures.
POs-4
Investigation: Conduct experiments and analyze data in electronics and communication systems.
POs-5
Modern Tool Usage: Use modern tools such as CAD tools, FPGA platforms, and VLSI design software.
POs-6
Engineer & Society: Understand the societal impact of semiconductor and communication technologies.
POs-7
Environment & Sustainability: Apply sustainable practices in electronic system design.
POs-8
Ethics: Demonstrate professional and ethical responsibility.
POs-9
Individual & Team Work: Work effectively as an individual and in multidisciplinary teams.
POs-10
Communication: Communicate effectively with engineering and non-engineering audiences.
POs-11
Project Management: Manage projects and apply engineering principles efficiently.
POs-12
Lifelong Learning: Engage in continuous learning to adapt to emerging technologies.
Programme Specific Outcomes (PSOs)
PSO-1
Design and develop VLSI circuits and integrated systems.
PSO-2
Apply semiconductor fabrication and packaging techniques in real-world applications.
PSO-3
Use EDA tools for chip design, simulation, and verification.
PSO-4
Develop solutions for advanced electronic and communication systems.
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